收藏本站
MLCC with FLEXITERM ?
Specifications and Test Methods
PERFORMANCE TESTING
BOARD BEND TEST PROCEDURE
According to AEC-Q200
AEC-Q200 Qualification:
? Created by the Automotive Electronics
Council
? Specification defining stress
test qualification for
Test Procedure as per AEC-Q200:
Sample size: 20 components
Span: 90mm Minimum deflection spec: 2 mm
? Components soldered onto FR4 PCB (Figure 1)
LOADING
KNIFE
MOUNTING
passive components
Testing:
Key tests used to compare
? Board connected electrically to the test equipment
(Figure 2)
BEND TESTPLATE
DIGITAL
CALIPER
ASSEMBLY
soft termination to
AEC-Q200 qualification:
? Bend Test
? Temperature Cycle Test
BOARD BEND TEST RESULTS
AEC-Q200 Vrs AVX FLEXITERM ? Bend Test
CONNECTOR
CONTROL PANEL
Fig 1 - PCB layout with electrical connections
CONTROL
PANEL
Fig 2 - Board Bend test
equipment
12
10
8
6
4
2
0603
12
10
8
6
4
2
0805
AVX ENHANCED SOFT
TERMINATION BEND TEST
PROCEDURE
0
NPO
X7R
X7R soft term
0
NPO
X7R
X7R soft term
Bend Test
12
10
8
1206
12
10
8
1210
The capacitor is soldered to the printed circuit
board as shown and is bent up to 10mm at
1mm per second:
6
4
2
6
4
2
0
NPO
X7R
X7R soft term
0
NPO
X7R
X7R soft term
Max. = 10mm
TABLE SUMMARY
Typical bend test results are shown below:
Style Conventional Termination FLEXITERM ?
0603 >2mm >5mm
0805 >2mm >5mm
1206 >2mm >5mm
TEMPERATURE CYCLE TEST PROCEDURE
Test Procedure as per AEC-Q200:
The test is conducted to determine the resistance of the
component when it is exposed to extremes of alternating
high and low temperatures.
? Sample lot size quantity 77 pieces
? TC chamber cycle from -55oC to +125oC for 1000 cycles
? Interim electrical measurements at 250, 500, 1000 cycles
? Measure parameter capacitance dissipation factor,
insulation resistance
Test Temperature Profile (1 cycle)
+125 0 C
+25 0 C
-55 0 C
1 hour 12mins
56
90mm
? The board is placed on 2 supports 90mm
apart (capacitor side down)
? The row of capacitors is aligned with the
load stressing knife
Max. = 10mm
? The load is applied and the deflection where
the part starts to crack is recorded (Note:
Equipment detects the start of the crack
using a highly sensitive current detection
circuit)
? The maximum deflection capability is 10mm
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
AVE477M10G24T-F CAP ALUM 470UF 10V 20% SMD
AVEK337M10G24T-F CAP ALUM 330UF 10V 20% SMD
AVES226M35D16T-F CAP ALUM 22UF 35V 20% SMD
AVEZ476M35X16T-F CAP ALUM 47UF 35V 20% SMD
AVRF107M35F24T-F CAP ALUM 100UF 35V 20% SMD
AVS107M50G24B-F CAP ALUM 100UF 50V 20% SMD
B048F160T24 BCM BUS CONVERTER 16V 240W
B048F320T30 BCM BUS CONVERTER 32V 300W
相关代理商/技术参数
AU016D104KAG2A-5K 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100nF 10% 6.3 Volts Gold Flash RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D104MAG2A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 0.1uF 20% X5R 0201 SIZE RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D223KA72A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 0.01uF 10% X5R 0201 SIZE RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU016D223KAG2A 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3volts 22000pF 10% X5R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
AU01A 制造商:Sanken Electric Co Ltd 功能描述:Pack 制造商:Sanken Electric Co Ltd 功能描述:Bulk
AU01AV 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL
AU01AV0 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL
AU01AV1 制造商:Sanken Electric Co Ltd 功能描述:DIODE FAST REC AXIAL